典型常用的材料分析儀器(Typical Materials Analysis Instruments)

分析儀器的硬體結構主要基本元件有三：光源、試片承載台、和訊號偵測器。電子顯微鏡需要真空環境，所以增加一真空系統，包含柱體、幫浦、真空計。現代常用的材料分析儀器幾乎都用個人電腦控制，所以又加上電子控制系統。電腦操控技術的進步日新月異，大幅改善儀器操作方式，舊型的SEM純用手移動試片位置，現在的SEM只要用滑鼠在螢幕的即時影像上，點在某一位置，該位置即自動移到螢幕中心。

The basic configuration of analytical instruments is consisted of three major parts: source, sample loader, and signal detectors. Electron microscopes need a vacuum environment, so a vacuum system, including column, pumps, and vacuum gauges, has to be added. Almost all current materials analytical instruments are controlled by PCs now, thus a set of electronic control system is added. The method of operating new model instrument has become much easy by means of PC control. Take the SEM for example, it moved the specimen to any feature to the screen center manually. For new types of SEM, once an interested feature is double clicked by a mouse by the operator, it moves to the screen center automatically.   

從功能來分，典型常用的材料分析儀器可分為三大類，如圖6所示:

顯微鏡 – 提供材料顯微結構的放大影像。有

AFM, FIB, SEM, STM, TEM, Thermal wave imaging, X-ray 影像儀等。

能譜儀/質譜儀 – 提供試片特定區域組成元素的訊息。有

AES , EDS, EPMA, ESCA(XPS), EELS, FTIR, Raman, RBS, SIMS, TXRF, WDS, XRF等。

繞射儀 – 提供試片特定區域晶體結構的訊息。

TEM/Diff, XRD等。

Typical materials analysis instruments are divided into three groups by their function, as shown in Fig. 6. They are:

Microscopes – offering images of high magnification and high resolution, such as:

AFM, FIB, SEM, STM, TEM, Thermal wave imaging, X-ray imaging systems, et al.

Spectroscopes – offering composition information of an interested region, such as:

AES , EDS, EPMA, ESCA(XPS), EELS, FTIR, Raman, RBS, SIMS, TXRF, WDS, XRF, et al.

Diffractometers – offering crystallography information of a sample or an interested region, such as:

TEM/Diff, XRD, et al.

圖6. 典型常用材料分析儀器的功能性分類與提通的訊息。

依光源和訊號類別的組合，則典型常用的材料分析儀器可分類如表1中的歸類。

Typical materials analysis instruments can also be divided into groups by types of sources and signals, as shown in table 1.

表1. 光源和訊號類別分類典型常用的材料分析儀器。